Individual Pogo Pin
A single spring-loaded contact supplied for integration into the customer’s PCB, housing or connector structure.
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Individual vertical SMT spring-loaded pogo pin with a cylindrical body and surface-mount PCB base for single-point electrical interfaces. The plunger provides controlled axial compliance against a defined mating target, while PCB land pattern, solder-joint design, working stroke, spring force and electrical capability are defined by the approved part and project requirements.
Determine whether the project needs a single spring-loaded contact, a multi-contact connector assembly, a specific mounting method or a customer-defined mechanical interface.
A single spring-loaded contact supplied for integration into the customer’s PCB, housing or connector structure.
Browse Individual Pogo Pins →A complete multi-contact assembly combining pogo pins, insulating housing, contact pitch and mounting structure.
Browse Connector Assemblies →Choose through-hole, surface mount, right-angle, double-ended or customer-specific termination.
Review Engineering Guides →Define travel, spring force, current path, housing, Pin Map and device-side mechanical constraints.
Submit Project Requirements →This product is an individual vertical SMT spring-loaded pogo pin designed for surface-mounted PCB integration. A circular mounting base replaces the long through-hole tail used by DIP pogo pin structures, allowing one compliant electrical contact to be integrated directly onto a PCB surface.
The spring-loaded plunger provides controlled axial compliance against a defined mating target. PCB pad geometry, solder-joint design, working compression and device-level mechanical support should be reviewed together as one interface.
This SKU is an individual spring-loaded contact rather than a multi-contact pogo pin connector. Its defining integration feature is the SMT / SMD mounting base at the PCB end of the cylindrical pogo pin body.
The surface-mount architecture should be distinguished from DIP pogo pins, which use a tail that passes through the PCB.
SMT and DIP pogo pins can provide similar spring-contact functions but use different PCB termination architectures. This version mounts to a surface pad rather than passing a tail through a plated PCB hole.
Selection should consider PCB stack-up, available board area, assembly process, mechanical loading and required contact height.
The visible pogo pin includes an enlarged circular base at the mounting end. Final base diameter, solderable area, PCB pad geometry and any required solder-mask clearance should follow the approved mechanical and PCB drawings.
A recommended land pattern should be released together with the pogo pin drawing so the PCB designer does not need to estimate pad dimensions from the product image.
The solder joint provides electrical termination and PCB attachment, but it should not automatically be treated as the structural stop for the mating assembly.
Where the pogo pin can experience lateral force, bending, shock or repeated side loading, the surrounding housing or mechanical structure should manage those loads according to the approved device design.
The pogo pin itself should operate primarily within its intended axial compression range.
SMT classification does not automatically establish compatibility with tape-and-reel packaging, vacuum pick-and-place equipment or a specific reflow process.
Packaging format, pickup geometry, solder paste application and soldering profile should be confirmed before production assembly requirements are published.
Working stroke is the intended operating compression range of the spring-loaded plunger and should be distinguished from total available mechanical travel.
Free height, PCB-mounted height, working height and recommended compression should be reviewed together with the target-contact position.
The device-level mechanical structure should define the final mating stop so the pogo pin remains within its intended operating range.
The rounded plunger tip operates against a defined mating target. Target diameter, target position, surface condition, lateral tolerance and operating compression should be specified as part of the complete contact interface.
The surrounding mechanical structure should control X/Y alignment and final seating rather than relying on the pogo pin to correct uncontrolled positional error.
Current capability should be evaluated across the complete conductive path:
Source → PCB Copper → SMT Pad → Solder Joint → Pogo Pin Base → Internal Contact Path → Plunger → Mating Interface → Target Conductor → Load.
External pin diameter, visual size or a previous 5–10A page claim is not sufficient to establish an approved current rating.
For a complete path resistance Rpath, voltage drop follows Vdrop = I × Rpath and resistive power loss follows Ploss = I² × Rpath.
For an SMT pogo pin, the PCB copper geometry and solder joint are part of the electrical and thermal path. Current capability should therefore be reviewed together with PCB copper area, pad geometry, solder quality, internal contact resistance, mating resistance and allowable temperature rise.
Contact resistance can depend on operating compression, mating target, measurement points, test current and surface condition.
Resistance data should only be published together with the corresponding measurement definition and whether the value represents initial or post-life performance.
The visible pogo pin body appears cylindrical and does not show an obvious external thread. Threaded mounting terminology should therefore not be used as a product attribute unless the approved mechanical drawing confirms a threaded section.
The gold-colored appearance does not establish plating composition, underplate or plating thickness. Plunger, barrel, spring, base and plating materials should follow the approved BOM or part specification.
Material selection alone should not be used to imply current capability, corrosion resistance, cycle life or suitability for a specific regulated industry.
This vertical SMT pogo pin can be evaluated for PCB-mounted interfaces requiring one axially compliant electrical contact without a through-hole PCB tail.
Application suitability depends on board area, PCB pad geometry, solder process, available height, mating-target position, working compression and mechanical loading.
CTP can review project-specific requirements for overall height, body diameter, plunger geometry, SMT base dimensions, PCB land pattern, working height, working stroke, spring force, material and plating specification.
Final dimensions, PCB requirements and performance parameters should be released through an approved pogo pin drawing and assembly specification.
This product is an SMT / SMD surface-mount pogo pin. It uses a surface-mount PCB base rather than a long tail passing through a PCB hole.
The pogo pin is mounted upright on the PCB so the spring-loaded plunger moves approximately perpendicular to the PCB surface.
The recommended land pattern should be defined from the approved SMT base dimensions, soldering process and PCB fabrication requirements rather than estimated from product photography.
SMT classification alone does not confirm automatic pick-and-place compatibility. Packaging format, pickup geometry, component stability and assembly process should be reviewed for the specific project.
The solder joint should not automatically be used as the device-level structural stop. Final mating position and significant side loads should be controlled by the surrounding mechanical design.
Current capability is project-specific and should be evaluated across the PCB copper, SMT pad, solder joint, pogo pin, mating interface, target conductor and complete load path.
The visible product does not show an obvious external thread. Threaded terminology should only be used if confirmed by the approved mechanical drawing.
Provide the available PCB area, required height, SMT base geometry, mating target, working stroke, spring force, electrical requirements, assembly process and available drawings for engineering review.
If this vertical surface-mount pogo pin architecture is close to your PCB contact requirement, submit the available board area, SMT pad geometry, installation height, mating target, working stroke, spring-force condition and electrical requirements for engineering review.
Request Custom Quote & Samples | See Multi-Contact Pogo Pin Connector Assemblies
This product page presents a CTP pogo pin configuration for engineering reference. Final dimensions, electrical ratings, materials, magnet structure, sealing level and reliability targets are not universal values; they are confirmed against the approved drawing, installation condition and model-specific validation plan.
CTP reviews the application and prepares a drawing or specification for approval before sample production. Test scope, acceptance criteria and report format should identify the model, sample status, method, conditions, result and review date.
Yes. Customization can cover geometry, contact layout, materials, cable construction, magnetic structure, sealing and appearance. Feasibility depends on the application and approved specification.
No. Current, voltage, resistance, temperature rise and ingress-protection claims apply only to the identified model and stated test conditions.
Timing is confirmed after the drawing, materials, tooling, sample quantity, validation scope and production requirements have been reviewed.
The development route depends on whether an existing pogo pin can be used, modified or assembled into a customized multi-contact connector.
Confirm product type, dimensions, stroke, force, current, mounting and project quantity.
Match the contact geometry, tail structure, housing, Pin layout and installation method.
Confirm dimensional tolerances, material requirements and sample configuration.
Review electrical, mechanical, assembly and application-specific validation conditions.
Submit the product type, dimensions, mounting method, working stroke, spring-force condition, electrical requirements, Pin Map, PCB layout and available drawings for project review.
Our high-precision pogo pin connectors can be seamlessly integrated into a wide range of industries. Explore our core application areas below. Feel free to contact our engineering team for custom solutions.
TWS Earbuds & Watches
Healthcare Equipment
High Current Systems
Data Transmission
IoT & LED Lighting
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